PřF:F6540 Phys.princ.semicon.technol. - Course Information
F6540 Physical principles of the semiconductor technology
Faculty of Scienceautumn 2021
- Extent and Intensity
- 3/0/0. 3 credit(s) (plus extra credits for completion). Type of Completion: k (colloquium).
- Teacher(s)
- RNDr. Petr Pánek, Ph.D. (lecturer), doc. RNDr. Petr Mikulík, Ph.D. (deputy)
- Guaranteed by
- doc. RNDr. Petr Mikulík, Ph.D.
Department of Condensed Matter Physics – Physics Section – Faculty of Science
Contact Person: doc. RNDr. Petr Mikulík, Ph.D.
Supplier department: Department of Condensed Matter Physics – Physics Section – Faculty of Science - Timetable
- Mon 11:00–13:50 Kontaktujte učitele
- Course Enrolment Limitations
- The course is offered to students of any study field.
- Course objectives
- The main purpose of the lectures given by experts from industry is to provide the students ability to:
- list and describe individual steps in semiconductors production and device manufacturing
- find how basic physics is applied in semiconductors production manufaturing
- understand how industrial processes are optimized using physics and chemistry models - Learning outcomes
- Student will be able upon completion of the lectures:
- identify and describe key steps in silicon wafer and device manufacturing;
- describe silicon crystal growing process and identify key input and output process parameters;
- describe basic types of silicon lattice defects;
- describe methods for silicon surface contamination analysis and processes of contaminant removal;
- describe process mechanism and equipment used for epitaxial layer deposition;
- describe diffusion process and oxidation of silicon and identify key input parameters;
- describe photolithography process and basic optical effects in the process;
- prepare simple design of experiment and explain coding of input factors; - Syllabus
- The following topics will be covered:
- Silicon wafer manufacturing technology overview
- Silicon single crystal growth
- Defects in silicon
- Surface analysis in semiconductor manufacturing
- Polishing and cleaning of silicon wafers
- Silicon device fabrication overview
- Silicon oxidation and impurity diffusion
- Chemical vapor phase deposition and plasma assisted layer deposition
- Photolithography, silicon oxide etching
- Dry etching, metal sputtering
- Applied statistics in industry
- Literature
- WOLF, Stanley and Richard N. TAUBER. Silicon Processing for the VLSI Era. Sunset Beach, California, U.S.A.: Lattice Press, 1999, 960 pp. Vol. 1: Process Technology. ISBN 978-0961672164. info
- KERN, Werner. Handbook of Semiconductor Wafer Cleaning Technology: Science, Technology, and Applications. New Jersey, U.S.A.: Noyes Publications, 1993, 623 pp. Materials Science and Process Technology Series. ISBN 978-0815513315. info
- KITTEL, Charles. Úvod do fyziky pevných látek. 1. vyd. Praha: Academia, 1985, 598 s. URL info
- Teaching methods
- Lectures and presentations by professionals from the field
- Assessment methods
- final individual project
- Language of instruction
- Czech
- Further comments (probably available only in Czech)
- Study Materials
The course is taught once in two years.
General note: L (Předmět je vyučován liché kalendářní roky. O opravný termín kolokvia je ale možné požádat i v podzimním semestru sudých kalendářních roků.).
- Enrolment Statistics (autumn 2021, recent)
- Permalink: https://is.muni.cz/course/sci/autumn2021/F6540