F6540 Basics of semiconductor technology

Faculty of Science
Autumn 2023
Extent and Intensity
3/0/0. 3 credit(s) (plus extra credits for completion). Type of Completion: k (colloquium).
Teacher(s)
RNDr. Petr Pánek, Ph.D. (lecturer), doc. RNDr. Petr Mikulík, Ph.D. (deputy)
Guaranteed by
doc. RNDr. Petr Mikulík, Ph.D.
Department of Condensed Matter Physics – Physics Section – Faculty of Science
Contact Person: doc. RNDr. Petr Mikulík, Ph.D.
Supplier department: Department of Condensed Matter Physics – Physics Section – Faculty of Science
Timetable
Mon 12:00–14:50 Fs1 6/1017
Course Enrolment Limitations
The course is offered to students of any study field.
Course objectives
The main purpose of the lectures given by experts from industry is to provide the students ability to:
- list and describe individual steps in semiconductors production and device manufacturing
- find how basic physics is applied in semiconductors production manufaturing
- understand how industrial processes are optimized using physics and chemistry models
Learning outcomes
Student will be able upon completion of the lectures:
- identify and describe key steps in silicon wafer and device manufacturing;
- describe silicon crystal growing process and identify key input and output process parameters;
- describe basic types of silicon lattice defects;
- describe methods for silicon surface contamination analysis and processes of contaminant removal;
- describe process mechanism and equipment used for epitaxial layer deposition;
- describe diffusion process and oxidation of silicon and identify key input parameters;
- describe photolithography process and basic optical effects in the process;
- prepare simple design of experiment and explain coding of input factors;
Syllabus
  • The following topics will be covered:
  • Silicon wafer manufacturing technology overview
  • Silicon single crystal growth
  • Defects in silicon
  • Surface analysis in semiconductor manufacturing
  • Polishing and cleaning of silicon wafers
  • Silicon device design and fabrication overview
  • Silicon oxidation and impurity diffusion
  • Chemical vapor phase deposition and plasma assisted layer deposition
  • Photolithography, silicon oxide etching
  • Dry etching, metal sputtering
  • Applied statistics in industry
Literature
  • WOLF, Stanley and Richard N. TAUBER. Silicon Processing for the VLSI Era. Sunset Beach, California, U.S.A.: Lattice Press, 1999, 960 pp. Vol. 1: Process Technology. ISBN 978-0961672164. info
  • KERN, Werner. Handbook of Semiconductor Wafer Cleaning Technology: Science, Technology, and Applications. New Jersey, U.S.A.: Noyes Publications, 1993, 623 pp. Materials Science and Process Technology Series. ISBN 978-0815513315. info
  • KITTEL, Charles. Úvod do fyziky pevných látek. 1. vyd. Praha: Academia, 1985, 598 s. URL info
Teaching methods
Lectures and presentations by professionals from the field
Assessment methods
final individual project
Language of instruction
Czech
Further comments (probably available only in Czech)
Study Materials
The course is taught once in two years.
General note: L (Předmět je vyučován liché kalendářní roky. O opravný termín kolokvia je ale možné požádat i v podzimním semestru sudých kalendářních roků.).
The course is also listed under the following terms Spring 2008 - for the purpose of the accreditation, Spring 2002, Spring 2004, Spring 2006, Spring 2008, Spring 2010, Autumn 2011, Autumn 2011 - acreditation, spring 2012 - acreditation, Autumn 2013, Autumn 2015, autumn 2017, Autumn 2019, autumn 2021.
  • Enrolment Statistics (recent)
  • Permalink: https://is.muni.cz/course/sci/autumn2023/F6540